Description

Product Information

The Disco DFD6341 Fully Automatic Dicing Saw, manufactured in May 2022, is a pre-owned unit in working order, designed for enhanced productivity with its dual spindle system. This model supports Φ8-inch wafers and incorporates technology from the DFD6362, allowing for increased throughput. It features a unique axis mechanism enabling X-axis return speeds up to 1,000 mm/s, improving acceleration and deceleration for maximum speed movement. The space-saving design reduces the footprint by 3% compared to previous models, and it includes a user-friendly GUI with an LCD touch panel for easy operation. The DFD6341 is ideal for applications requiring precise dicing of semiconductor wafers, offering optional high-speed flash alignment for reduced alignment time.

Technician comment

Preowned from a working environment, decommissioned April 2026

Key Features

Dual spindle system
X-axis return speed up to 1,000 mm/s
Space-saving design
User-friendly GUI with LCD touch panel
Optional high-speed flash alignment

Specifications

Voltage: 200-240V
Hertz: 50Hz/60Hz
Max. workpiece size: Φ8 inch
X-axis cutting range: 210 mm
X-axis cutting speed: 0.1 ～ 1,000 mm/s
Y1･Y2-axis cutting range: 210 mm
Index step: 0.0001 mm
Positioning accuracy: Within 0.002/210 mm
Z-axis max. stroke: 19.22 mm (Φ2 inch blade)
Z-axis moving resolution: 0.00005 mm
Repeatability accuracy: 0.001 mm
θ-axis max. rotating angle: 380 degrees
Spindle rated torque: 0.19 N・m (1.2 kW/High speed rotation)
Rotation speed range: 6,000 ～ 60,000 min‐1 (1.2 kW/1.8 kW)
Equipment dimensions (W×D×H): 1,180 × 1,080 × 1,820 mm
Equipment weight: Approx. 1,500 kg

Weight

Imperial: 3960.0 Pounds
Metric: 1796.22 Kilograms

Shipping Dimensions

Imperial: 55.2 in x 57.6 in x 90.0 in
Metric: 140.21 cm x 146.3 cm x 228.6 cm

Harmonized Code

8464.10

Harmonized Code Details

Machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold working glass. Suitable for semiconductor wafer dicing applications.