Description
The Epo-Tek H22 Adhesive is a specialized two-component, silver-filled epoxy system designed for critical applications in die bonding and sealing hybrid circuit packages. This adhesive is formulated to provide reliable performance in demanding environments, ensuring secure and durable bonds. It is supplied in a convenient 1 oz syringe with a built-in plunger for precise application. The material is not sticky at room temperature but becomes adhesive upon curing, which typically takes 16 hours for a full cure.
- Two-component, silver-filled epoxy system
- Ideal for die bonding and sealing hybrid circuit packages
- Supplied in a 1 oz syringe with a built-in plunger
- Full cure time of 16 hours
- Not sticky at room temperature, becomes adhesive upon curing
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